Besides being widely applied in open-source and commercial projects, Open CASCADE Technology (OCCT) is actively used at academic and research levels around the globe. Here are the examples of research and scientific publications using OCCT.
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Publication source:
EGC: Extraction et Gestion des
Connaissances
Organizations of authors:
Laboratoire Jean Kuntzmann, Université de Montpellier
Publication source:
Journal of Numerical Mathematics
Organizations of authors:
SISSA International School for Advanced Studies, Heidelberg University, Colorado State University, Friedrich-Alexander-Universit?t Erlangen-N?rnberg, University of California, Clemson University, Max Planck Institute for Plasma Physics, Technical University of Munich, University of Minnesota, Oak Ridge National Laboratory, Rensselaer Polytechnic Institute, Troy, NY, USA
Publication source:
The International Journal of Advanced Manufacturing Technology
Organizations of authors:
Xi’an Jiaotong University
Publication source:
AIP Conference Proceedings
Organizations of authors:
Publication authors:
Petsch M., Kohlgr?ber D., Heubischl J.
Organizations of authors:
German Aerospace Center (DLR)
Organizations of authors:
Korea Institute of Science and Technology Information (KISTI)
Organizations of authors:
Hochschule Geisenheim University
Publication source:
Thesis Universit?t Stuttgart
Organizations of authors:
Publication source:
Book: Mathematical immunology of virus infections
Organizations of authors:
Marchuk Institute of Numerical Mathematics Russian Academy of Sciences, Institut Camille Jordan Centre National de la Recherche Scientifique, RUDN University, Institute of Immunobiology Kantonsspital St. Gallen, Parc de Recerca Biomedica Barcelona ICREA and Universitat Pompeu Fabra
Country:
Russia
Spain
France
Switzerland
Spain
Publication source:
ASME Gas Turbine Conference
Publication authors:
Jesudasan R., Zhang X., Mueller J.
Organizations of authors:
Queen Mary University of London
Publication source:
World Congress on Computational Mechanics
Organizations of authors:
Publication source:
Fusion Engineering and Design
Organizations of authors:
Chinese Academy of Sciences, Huaibei Normal University, Collaborative Innovation Center of Radiation Medicine of Jiangsu Higher Education Institutions
Publication source:
Multimedia Tools and Applications
Publication authors:
Huangfu Z.-M., Zhang S.-S., Yan L.-H.
Organizations of authors:
North China University of Water Resources and Electric Power, Northwestern Polytechnical University
Publication authors:
Lara, B., Fagua, E., Salamanca, J., E Higuera O.
Organizations of authors:
Universidad Pedag?gica y Tecnol?gica de Colombia
Publication source:
ISPRS - International Archives of the Photogrammetry, Remote Sensing and Spatial Information Sciences
Organizations of authors:
Publication source:
International Journal of Mechanical, Aerospace, Industrial, Mechatronic and Manufacturing Engineering
Publication authors:
Moradian N., Timofeev E., Tahir R.
Organizations of authors:
McGill University, Etobicoke
Publication authors:
Radomski S., Muc A., Szelezi?ski A.
Organizations of authors:
Gda?ska Szko?a Wy?sza, Akademia Morska w Gdyni
Publication source:
Robotics and Computer-Integrated Manufacturing
Organizations of authors:
Huazhong University of Science and Technology
Publication source:
Advanced Engineering Informatics
Organizations of authors:
Technical University of Eindhoven (TU/e)
Publication source:
Conference: 5. Workshop mit der Universit?t zu K?ln
Organizations of authors:
German Aerospace Center (DLR)
Publication source:
Conference: Deutscher Luft- und Raumfahrtkongress 2017
Publication authors:
M. Petsch, D. Kohlgr?ber, J. Walther
Organizations of authors:
Deutsches Zentrum f?r Luft- und Raumfahrt e.V. (DLR)
Publication authors:
Foat T. G., Nally J., Parker S. T.
Organizations of authors:
Dstl Porton Down, University of Southampton
Organizations of authors:
Imperial College London, University of Exeter, ITI Global
Publication source:
Multimedia Tools and Applications
Organizations of authors:
Vicomtech-IK4 Research Center
Publication source:
Conference: Reliability by Design (Zuverl?ssigkeit und Entwurf)
Publication authors:
Fischbach R., Heinig A., Lienig J.
Organizations of authors:
Fraunhofer Institute for Integrated Circuits, Technical University of Dresden
