Fabrication of copper powder hybrid supported fillers with interconnected 1D/2D/3D nanostructures for enhanced thermal interface materials properties

Publication source: 
Int. J. Adv. Manuf. Technol., vol. 121, no. 5–6, pp. 3453–3462, 2022
Publication authors: 
S.-W. Wu, T.-C. Chang, Y.-H. Lin, H.-F. Chen, Y.-K. Fuh
Scope of application: 
Computer-aided Manufacturing
Organizations of authors: 
National Central University, Institute of Nuclear Energy Research
Year of publication: